Credit: BusinessWire

CORVALLIS, Ore.–(BUSINESS WIRE)–Inpria, a pioneer in high-resolution metal oxide photoresists for extreme ultraviolet lithography (EUV), today announced that it has secured $23.5 million in Series B funding from a stellar syndicate representing leading players from across the semiconductor manufacturing ecosystem. This new financing was led by existing investor, Samsung Ventures, and included participation from current investors ALIAD (Air Liquide’s venture capital investment arm), Applied Ventures (the venture capital arm of Applied Materials, Inc.), and Intel Capital. Leading photoresist supplier JSR Corporation also joined this round as a new investor. Fueled by growing customer demand, Inpria will use the funds to complete its pilot manufacturing facility and to commence commercial production. The company intends to grow its workforce to support more customer engagements through the joint development of integrated processes for the industry’s most advanced production environments.

http://www.businesswire.com/news/home/20170710005397/en/EUV-Photoresist-Pioneer-Inpria-Raises-23.5-Million

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Soft Skills Executive | Technical & Non-Technical Business Acumen | Strategy, Implementation, Execution